NM Wafer Packaging Manufacturing Advanced Packaging Engineer

Note: This position requires regular onsite presence to perform essential job responsibilities.

New Mexico Wafer Packaging Manufacturing (NMWPM) is expanding, and we are seeking Module Engineers specializing in Wafer-Level Assembly, Die Preparation, and Metrology. These roles will support both high-volume manufacturing (HVM) and technology development activities, including process transfers and product start-ups for Foveros, Embedded Bridge, and Intel Foundry Services (IFS) technologies.

• ◆Drive sustained operational excellence by proactively identifying and implementing safety and ergonomic improvements, excursion prevention measures, and initiatives that enhance equipment availability, utilization, and cost efficiency.
• ◆Collaborate with partner factories to transfer new processes, maintain Copy Exactly standards, share best practices, and drive continuous improvements in processes and equipment performance.
• ◆Develop and execute technology roadmaps to achieve process requirements, business objectives, and key milestones.
• ◆Install, qualify, and ramp equipment and manufacturing processes to support new product introductions and production start-up milestones.
• ◆Lead efforts to resolve complex technical challenges and implement robust systems that prevent recurrence.
• ◆Support and sustain development and pilot production lines during early test vehicle and production phases.
• ◆Partner closely with engineers, technicians, integration teams, shift leadership, and management to deliver development and manufacturing commitments.
• ◆Evaluate, qualify, and implement new hardware, software, and equipment upgrades.
• ◆Lead critical task forces and cross-functional initiatives related to areas of ownership and adjacent manufacturing processes.

• ✓Bachelor's degree in a STEM or related engineering discipline with 4+ years of relevant semiconductor industry experience; or
• ✓Master's degree in a STEM or related engineering discipline with 3+ years of relevant semiconductor industry experience; or
• ✓PhD in a STEM or related engineering discipline with relevant academic or research experience in semiconductor technologies, electronics, mechanical engineering, manufacturing processes, or closely related fields.

• ✓Semiconductor processing and manufacturing
• ✓Process characterization and optimization
• ✓Manufacturing process control methodologies
• ✓Continuous process improvement initiatives
• ✓Equipment maintenance and troubleshooting
• ✓Design of Experiments (DOE) and data-driven problem solving

Applicable experience may be obtained through a combination of the areas listed above and does not need to be accumulated separately within each discipline.

For candidates qualifying through the PhD pathway, relevant academic research, laboratory work, publications, or dissertation projects may be considered in lieu of additional full-time industry experience.

• ✓Hands-on experience in a semiconductor manufacturing environment, with a focus on process sustaining and/or process development.
• ✓Knowledge of statistical analysis and experimental design methodologies, including their application to tool matching, tool qualification, and process optimization.
• ✓Understanding of semiconductor process flows (logic and memory) and related metrology techniques and assessments.
• ✓Proven project management skills, including experience leading cross-functional teams or task forces to solve complex technical challenges.
• ✓Strong communication and collaboration skills, with the ability to work effectively across diverse teams, functions, and geographic regions.

Join us in shaping the future of semiconductor innovation. Apply now and become part of a team that is redefining the limits of technology through advanced manufacturing excellence. Minimum