
Packaging Module Engineering Technician
Intel · Arizona
- Level
- Engineer
- Team
- Manufacturing
- Base pay
- $52k–$100k
- Degree
- Required
- Experience asked
- 1+ years
- Industry
- Industrial
- Posted
- Yesterday
The role in 30 seconds
An engineer-level manufacturing role at Intel (industrial) in Arizona. You Will Bring.
- They ask for
- 1+ years · degree required
- Tools it names
- Painting / coating, EHS / safety
- Base pay
- $52k–$100k
Read from the posting. The full description is below.
From the plant jobs report · week of November 2, 2026
Manufacturing Engineer roles in Arizona: typical posted base $88k–$123k. This one lists $52k–$100k.
Median of the low and high ends of 14 live postings that list pay, out of 35 manufacturing engineer openings in Arizona, read from manufacturers' own careers sites.
Arizona plant jobs report →Pay by team and state →What moves pay →
How this role compares
Against 34 other live manufacturing postings in Arizona.
- Base pay
- About 28% below similar roles
- Experience asked
- Less than usual (1+ vs 5+)
Typical $88k–$123k, from 12 postings that list pay.
Similar roles usually ask 5+ years.
Skills these teams ask for most
- Automation 40%
- Lean 40%
- Root cause 34%
- Team leadership 29%
- Tooling 29%
- New product launch 29%
✓ = this posting asks for it too. % = share of similar postings that mention it.
Stands out: this posting asks for Painting / coating, EHS / safety, which few similar roles mention. If you have it, lead with it.
At a glance
Pulled from the posting text. If it's not listed here, the posting didn't say.
How to get in at this plant
Five moves over a week or two. The first one takes ten minutes.
- 1
Pick 2–3 people on the Manufacturing team at Intel
We found 5 people at this company and state: 3 in this kind of role, 2 leaders. Engineers who joined in the last year or two reply the most. See them ↓
- 2
Send a short, curious note
One real question about their work. No favors yet. Each person gets a different note, written for this role.
Write to Finn → (free) - 3
Turn a reply into a short call
Questions worth asking about this team:
- What does a normal week look like on your team?
- Is the work mostly new product launches or sustaining existing lines?
- How much time do you spend on the floor versus at a desk?
- How did you land the job? What stood out in your interviews?
- 4
Apply with someone vouching for you
If the call went well, ask whether they’d pass your résumé to the hiring manager. Send your résumé link, apply that day, and let them know.
- 5
Bring proof to the interview
One page of before-and-after numbers from projects you led: scrap, OEE, cycle time, cost. Plant managers hire on results.
Full description from IntelAs posted on their careers site.ShowHide
Key Responsibilities
- ◆Perform materials characterization and analysis using microscopy, imaging, acoustic inspection, and other analytical techniques.
- ◆Prepare samples and coupons for testing through cross-sectioning, polishing, etching, ion milling, spin coating, and related preparation methods.
- ◆Operate characterization and test equipment including SEM/EDS, CSAM/TSAM, optical microscopy, elemental analysis, and mechanical testing systems.
- ◆Support material evaluations, process development activities, and failure analysis investigations.
- ◆Collect, analyze, document, and communicate characterization results and technical findings.
- ◆Maintain laboratory equipment through routine maintenance, calibration, and basic troubleshooting.
- ◆Ensure compliance with laboratory safety, quality, and documentation standards.
- ◆Collaborate with engineers and cross-functional teams to execute experiments and deliver timely analytical support.
- ◆Perform chemical handling, wet processing, and experiments in accordance with laboratory safety protocols and environmental health and safety (EHS) requirements.
qualifications
to be initially considered for this position.
requirements
and are considered a plus factor in identifying top candidates. Relevant experience can be obtained through schoolwork, classes and project work, internships, military training, and/or work experience. This Position is not eligible for Intel immigration sponsorship.
Preferred Qualifications
- ✓1+ years of experience or knowledge:
- ✓Operating analytical and characterization equipment such as SEM/EDS, optical microscopy, or similar tools.
- ✓Sample preparation techniques including cross-sectioning, polishing, etching, ion milling, water-jet cutting, spin coating, or related methods.
- ✓Collecting, documenting, and analyzing technical data in a laboratory or engineering environment.
- ✓Supporting semiconductor packaging, materials characterization, failure analysis, or process development activities.
- ✓Mechanical testing techniques such as button shear, die pull, or other material evaluation methods.
- ✓CSAM/TSAM equipment
Show full description ↓Show less ↑
Job Description
Intel Corporation is a global technology pioneer, designing and manufacturing the crucial silicon foundations that power the world’s digital infrastructure. You will join Intel's highly collaborative Advanced Packaging and Assembly team—a critical group focused on driving breakthrough packaging innovations. Our mission is to enhance production efficiency, optimize next-generation assembly processes, and deliver world-class semiconductor packaging solutions to customers globally.
We are seeking a detail-oriented and collaborative Packaging Module Engineering Technician to support advanced packaging technology development in Arizona. Operating in a state-of-the-art laboratory environment, this fully on-site role focuses on preparing samples, running analytical testing, and evaluating materials. You will work side-by-side with research engineers to generate high-quality analytical data that directly influences semiconductor process optimization, quality control, and failure analysis.
As a Successful Candidate, You Will Bring
- •Analytical & Solution-Oriented: A natural curiosity and logical approach to resolving nonstandard process, testing, and equipment issues.
- •Collaborative Communicator: Excellent interpersonal and communication skills to work effectively with cross-functional engineering and research teams.
- •Rigorous Attention to Detail: Outstanding precision, organization, and a steadfast commitment to laboratory quality and safety protocols.
- •Growth Mindset: An eagerness to master new characterization techniques and adapt to innovative semiconductor technologies.
Are you ready to accelerate your career at the forefront of semiconductor R&D and packaging innovation? Apply today to join Intel's Advanced Packaging team in Chandler, Arizona!
An applicant must meet one of the following criteria
- •An associate degree or a bachelor’s degree in a STEM-related discipline. No prior professional experience is required.
- •OR a High School Diploma (or GED) plus 1+ years in Material characterization, sample preparation, laboratory testing, or failure analysis.
Shift
Shift 1 (United States of America)
Primary Location
US, Arizona, Phoenix
Posting Statement
Position of Trust
N/A
Benefits
The range displayed on this job posting reflects the minimum and maximum target compensation for the position across all US locations. Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training. Your recruiter can share more about the specific compensation range for your preferred location during the hiring process.
Work Model for this Role
This role will require an on-site presence. * Job posting details (such as work model, location or time type) are subject to change.
ADDITIONAL INFORMATION: Intel is committed to Respons
