Reliability Engineer – Advanced Package, Heterogenous Integration, Interposer Technologies

Reliability Engineer – Advanced Package, Heterogenous Integration, Interposer Technologies Join a team at the forefront of semiconductor innovation, enabling the breakthrough technologies that differentiate Keysight's industry-leading design enablement solutions. As a Reliability Engineer, you will work hands-on with some of the world's most high-performance interconnect technologies that power next-generation RF, microwave, millimeter-wave, and high-speed digital products. In this role, you will play a critical part in ensuring that cutting-edge technologies meet the demanding performance, quality, and lifetime expectations of Keysight customers. You will collaborate closely with device engineers, process technologists, product designers, and manufacturing teams to evaluate, qualify, and continuously improve the technologies that form the foundation of Keysight's product leadership. If you are excited by advanced semiconductor technology, data-driven problem solving, and the challenge of ensuring reliability in products operating at the leading edge of performance, this role offers an opportunity to make a visible and lasting impact. What You'll Do Design, develop, and execute reliability qualification strategies for advanced packaging, heterogeneous integration, interposer technologies, and high-performance interconnect solutions. Evaluate emerging packaging and integration technologies, ensuring they meet the stringent reliability

of high-performance Test & Measurement applications. Investigate package- and interconnect-level degradation mechanisms and develop qualification methodologies that accurately predict field performance and lifetime. Apply advanced statistical and data analysis techniques to identify reliability risks, understand failure mechanisms, and guide technology development decisions. Build and expand package reliability characterization infrastructure, enabling rapid assessment of new technologies while supporting future growth in capability and test capacity. Partner with technology development, product engineering, manufacturing, and supply-chain teams to translate reliability data into action that drives product success. Communicate results to technical and business stakeholders, influencing technology roadmaps and qualification decisions.

We're looking for a highly motivated engineer or scientist who is excited by the challenge of developing and qualifying the advanced packaging and integration technologies that power Keysight's industry-leading measurement solutions. This role is ideal for candidates with expertise in advanced packaging, interposer, and interconnect reliability, and a passion for understanding how complex heterogeneous systems perform over long operating lifetimes.

This role requires a combination of practical hands-on experience, academic rigor, and analytical skills. B.S. in Electrical Engineering, Materials Science, Mechanical Engineering, Chemical Engineering, Physics, or a related technical field (or equivalent industry experience). Candidates must have proven experience in the following areas: Experience with advanced packaging, interposer, and heterogeneous integration technologies. Understanding of the physical mechanisms that influence long-term package and interconnect reliability. Experience developing and executing package reliability qualification plans and accelerated stress methodologies. Knowledge of degradation mechanisms including: thermomechanical fatigue, intermetallic compound growth, electromigration, stress migration, CTE mismatch-induced failures, delamination, moisture-induced failures, wire bond and flip-chip degradation, TSV, micro-bump, hybrid bond, and interposer failure mechanisms Experience with environmental and mechanical reliability testing such as: temperature cycling, thermal shock, highly accelerated stress testing (HAST) temperature-humidity-bias (THB), power cycling, mechanical shock and vibration Familiarity with reliability modeling methods used for package and interconnect lifetime prediction. Strong background in probability, statistics, and data analysis, with the ability to extract insights from complex reliability datasets. Excellent analytical and problem-solving skills, including root-cause investigation and failure mechanism identification. Effective communication and interpersonal skills, enabling productive collaboration across multidisciplinary engineering teams and external suppliers. A high level of ownership, accountability, initiative, and self-motivation, with a proactive approach to driving technical outcomes.

Knowledge of high-frequency packaging and interconnect technologies used in RF, microwave, and millimeter-wave products. Experience with finite element analysis (FEA), thermomechanical modeling, or reliability simulation tools. Familiarity with materials used in advanced packaging, including underfills, molding compounds, die attach materials, substrates, and interconnect metallurgies. Hands-on experience applying Statistical Process Control (SPC) and Design of Experiments (DOE) methodologies. Experience with package failure analysis techniques including cross-sectioning, SAM, SEM, FIB, dye-and-p