Advanced Packaging Metrology Engineering Manager
Intel · Oregon
- Level
- Manager
- Team
- Quality
- Base pay
- $156k–$255k
- Degree
- Required
- Experience asked
- 6+ years
- Industry
- Industrial
- Posted
- 24 days ago
The role in 30 seconds
A management quality role at Intel (industrial) in Oregon. In this pivotal role, you will drive innovation in wafer-level assembly technologies, champion manufacturing readiness, and deliver results that reinforce Intel's position as a global technology leader.
- They ask for
- 6+ years · degree required
- Base pay
- $156k–$255k
Read from the posting. The full description is below.
From the plant jobs report · week of October 19, 2026
Quality Engineer roles in Oregon: typical posted base $122k–$225k. This one lists $156k–$255k.
Median of the low and high ends of 8 live postings that list pay, out of 14 quality engineer openings in Oregon, read from manufacturers' own careers sites.
Oregon plant jobs report →Pay by team and state →What moves pay →
How this role compares
Against 13 other live quality postings in Oregon.
- Base pay
- About 21% above similar roles
- Experience asked
- Typical (6+ years)
Typical $121k–$220k, from 7 postings that list pay.
Similar roles usually ask 6+ years.
Skills these teams ask for most
- Root cause 79%
- FMEA 50%
- Supplier quality 50%
- Six Sigma 43%
- Control plans 43%
- Validation (IQ/OQ/PQ) 36%
✓ = this posting asks for it too. % = share of similar postings that mention it.
At a glance
Pulled from the posting text. If it's not listed here, the posting didn't say.
How to get in at this plant
Five moves over a week or two. The first one takes ten minutes.
- 1
Pick 2–3 people on the Quality team at Intel
We found 7 people at this company and state: 5 in this kind of role, 2 leaders. Engineers who joined in the last year or two reply the most. See them ↓
- 2
Send a short, curious note
One real question about their work. No favors yet. Each person gets a different note, written for this role.
Write to Erik → (free) - 3
Turn a reply into a short call
Questions worth asking about this team:
- What does a normal week look like on your team?
- Which standards drive the work here: ISO 13485, IATF 16949, AS9100?
- How much of the job is customer complaints versus prevention?
- How did you land the job? What stood out in your interviews?
- 4
Apply with someone vouching for you
If the call went well, ask whether they’d pass your résumé to the hiring manager. Send your résumé link, apply that day, and let them know.
- 5
Bring proof to the interview
One page of before-and-after numbers from projects you led: scrap, OEE, cycle time, cost. Plant managers hire on results.
Full description from IntelAs posted on their careers site.ShowHide
Key Responsibilities
- ◆Lead and inspire a team of engineers to develop advanced wafer processing and packaging solutions that push the boundaries of semiconductor technology.
- ◆Drive technology enablement, feasibility studies, and module improvement initiatives that align with Intel's strategic roadmap.
- ◆Ensure successful demonstrations of manufacturing capabilities at high volumes and manage seamless technology transfers to global manufacturing sites.
- ◆Partner with cross-functional teams — including integration, device, and yield engineering — to deliver process solutions that meet device specifications while optimizing safety, quality, and cost.
- ◆Collaborate with supplier executive management to identify and implement innovative concepts into manufacturing processes.
- ◆Execute long-term strategies for module engineering to support future technology needs and market demands.
- ◆Set clear, measurable team objectives and apply differentiated performance management to consistently drive results.
- ◆Coach, mentor, and develop engineers in skills growth, technology road mapping, and pathfinding for future innovations.
- ◆Foster a collaborative, inclusive, and psychologically safe team environment that encourages bold thinking and accountability.
qualifications
to be initially considered for this position.
requirements
and are considered a plus factor in identifying top candidates.
Qualifications
- ✓Bachelor’s degree in science, engineering, or a related STEM field with 6+ years of relevant experience; OR Master's degree in a related STEM field with 4+ years of relevant experience; OR PhD in a related STEM field with 4+ years of relevant experience.
- ✓Relevant experience can be any of the following:
- ✓Semiconductor wafer or assembly process, equipment, or materials development.
- ✓Process development methodology, project management, and schedule-based execution.
Preferred Qualifications
- ✓4+ years of experience in:
- ✓Metrology area
- ✓Managerial position
- ✓Wafer-level assembly or wafer-level packaging research and development.
- ✓Technical leadership in process development for semiconductor manufacturing.
- ✓Hybrid bonded interconnects (HBI), redistribution layer (RDL) packaging, and ultra-fine pitch solder connections.
- ✓Lead programs from strategy formation through high-volume production.
Show full description ↓Show less ↑
Job Description
Intel Corporation is a global technology leader at the forefront of semiconductor innovation, dedicated to creating world-changing technology that improves the lives of every person on the planet. Intel's Wafer-Level Assembly Technology Development (WATD) group is a dynamic, forward-thinking organization focused on developing next-generation packaging technologies. With a culture built on collaboration, inclusion, and relentless innovation, Intel offers an environment where your work truly matters — and where the future of technology is being written every day.
We are seeking a visionary and technically accomplished Advanced Packaging Metrology Engineering Manager to lead a high-performing team of engineers at the cutting edge of advanced semiconductor packaging. In this pivotal role, you will drive innovation in wafer-level assembly technologies, champion manufacturing readiness, and deliver results that reinforce Intel's position as a global technology leader. You will shape the future of advanced packaging by enabling robust process pathways, executing long-term technology strategies, and cultivating a team culture rooted in excellence, accountability, and collaboration.
As a Successful Candidate, You Will Bring
- •A Natural Leader — You inspire confidence, motivate teams, and bring out the best in the people around you.
- •A Clear Communicator — You articulate complex ideas with clarity and adapt your communication style to diverse audiences.
- •A Strategic Thinker — You see the big picture while staying grounded in the details that matter.
- •A Collaborative Partner — You thrive in cross-functional environments and build strong relationships with stakeholders at all levels.
- •A Coach and Mentor — You are genuinely invested in the growth and development of your team members.
- •An Innovative Problem-Solver — You approach challenges with curiosity, creativity, and a solutions-oriented mindset.
- •Resilient and Adaptable — You navigate ambiguity with composure and lead your team through change with confidence.
- •Inclusive and Empathetic — You champion diversity of thought and create environments where everyone feels valued and heard.
Are you ready to lead a team that's shaping the future of semiconductor technology? Join Intel's WATD group in Hillsboro, Oregon, and make your mark on the technologies that connect and enrich lives worldwide.
Shift
Shift 1 (United States of America)
Primary Location
US, Oregon, Hillsboro
Posting Statement
Position of Trust
N/A
Benefits
The range displayed on this job posting reflects the minimum and maximum target compensation for the position across all US locations. Within the range,