Senior Process Engineer – Substrate

Syenta · Tempe, AZ

Level: Senior
Team: Process
Degree: Required
Experience asked: 7+ years
Industry: Industrial
Posted: Recently

The role in 30 seconds

A senior process role at Syenta (industrial) in Tempe, AZ. In this hands-on role, you will develop critical components of the toolset, focusing on process development of (1) Photo Imageable Dielectric (PID) coating and patterning of precise, fine-line circuitry, and (2) Wafer Level Processing, including.

They ask for: 7+ years · degree required
Tools it names: Painting / coating

Read from the posting. The full description is below.

From the plant jobs report · week of October 19, 2026

Process Engineer roles in Arizona: typical posted base $108k–$149k.

Median of the low and high ends of 8 live postings that list pay, out of 12 process engineer openings in Arizona, read from manufacturers' own careers sites.

Arizona plant jobs report →Pay by team and state →What moves pay →

How this role compares

Against 11 other live process postings in Arizona.

Base pay: Not listed in this posting
Experience asked: More than usual (7+ vs 4+)

Skills these teams ask for most

Root cause 58%
DOE 33%
SPC 25%
Team leadership 25%
Lean 25%
Python 25%

✓ = this posting asks for it too. % = share of similar postings that mention it.

It asks for 7+ years. If you're close, apply anyway: requirements are a wish list. Talk to someone doing this work there first.

At a glance

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Full description from SyentaAs posted on their careers site.Show

About the Role

We are seeking a Senior Process Engineer (Substrate) to support the development of Syenta's advanced packaging toolset. In this hands-on role, you will develop critical components of the toolset, focusing on process development of (1) Photo Imageable Dielectric (PID) coating and patterning of precise, fine-line circuitry, and (2) Wafer Level Processing, including photolithography, etching, thin film deposition, wet processing, and metrology verification.

You will work across substrate build-up processes, general microfabrication, and characterization, contributing directly to the development of next-generation device production processes and helping translate prototypes into scalable manufacturing solutions.

Requirements

✓Bachelor's degree in physics, Chemistry, Materials Science, Electrical Engineering, Mechanical Engineering, or a related field.
✓Minimum 7 years of combined experience in microfabrication processes with demonstrated cleanroom proficiency from either an academic or industry background, and the ability to support seamless process integration
✓Hands-on experience with commonly used photoresist coating, exposure, and development tools and processes.
✓Knowledge of PID materials for interposer buildup.
✓Experience with etching processes (ICP, RIE, CCP, and wet etching)
✓Experience in metallization and thin-film deposition (PECVD, PVD, etc.)
✓Experience working in semiconductor-grade cleanroom environments

Preferred Qualifications

✓Master's or PhD in Physics, Chemistry, Materials Science, Electrical Engineering, Mechanical Engineering, or a related field
✓10+ years of combined experience in microfabrication processes with demonstrated cleanroom proficiency from either an academic or industry background
✓Experience in the semiconductor industry, particularly in advanced packaging or interposer/substrate build-up

Why Choose Syenta?

We’re building a team that takes ownership, moves fast, and solves meaningful technical challenges. At Syenta, you’ll play a central role in shaping a breakthrough manufacturing technology and see your work translate directly into real-world impact.

responsibilities

can expand significantly in tandem with the business

◆Team Events – Annual company event in Australia to collaborate and celebrate
◆Work-Life Balance – An understanding that meaningful work can coexist with a fulfilling personal life
◆15 days PTO and 10 days sick leave

Show full description ↓

About Syenta

Syenta is pioneering a new era in semiconductor manufacturing with our groundbreaking Localized Electrochemical Manufacturing (LEM) technology. Our manufacturing products build cutting edge advanced packaging for the semiconductor industry by combining patterning and metallization into a single tool. We do that by achieving high-speed, high-resolution metallization at significantly lower costs and energy use, while minimizing emissions and waste.

Founded in Australia, our growing footprint in the US represents a key milestone in our journey. We are building a world-class team where seasoned engineers and ambitious emerging talent collaborate to solve some of the toughest challenges in semiconductor manufacturing.

Process Development & Fabrication

•Develop and optimize Photo Imageable Dielectric (PID) and light-sensitive insulating material processes (e.g., PV-FX2 HR200) for advanced semiconductor packaging and fine-line circuit patterning
•Drive multi-layer build-up process development and support translation of prototype processes into scalable, high-yield manufacturing solutions for advanced packaging
•Execute microfabrication processes including photolithography, etching, thin film deposition, wet processing, and metrology verification (e.g., developing tool- and material-specific recipes)
•Troubleshoot microfabrication defects

Cross-Functional Collaboration

•Collaborate closely with Sydney team
•Ensure documentation is clear and thorough
•Work closely with materials scientists, chemists, and engineers to deliver prototypes and an integrated product
•Support transfer of developed processes to national and international commercial fabs
•Ensure clear, timely, and well-documented engagement with external suppliers

Characterization & Analysis

•Perform metrology and inspection to assess process quality and reproducibility
•Analyze experimental data and translate findings into process improvements
•Basic reliability testing literacy in TCT, HAST, MSL.

Innovation & Continuous Improvement

•Explore new lithography and fabrication techniques to improve resolution and performance
•Contribute to continuous improvement of fabrication workflows and process capability

What We Offer

•Early-stage equity opportunities
•Potential 401(k) and other benefits
•Comprehensive health, dental, and vision coverage plans, supported by Company
•Professional Growth – We’re scaling fast, so