Bond and Grind Process Technician

• ◆Work closely with Engineering team to develop and qualify new processes and new tool sets. This will include characterizing, documenting and possibly presenting data based around design of experiments (DOE).
• ◆Report and document process issues and equipment malfunctions. Take corrective action and interact with Process Engineers & Equipment Maintenance to identify and resolve non-conformance process and equipment operations.
• ◆Handle material depositions and work to resolve any lot issues that may arise.
• ◆Assist in creating new procedures and refining existing ones, and assist in maintaining reticle inventory system.
• ◆Work collaboratively to achieve quarterly set yield and cycle time goals.

• ✓Associate degree in Electronics Engineer Technology (EET) or Mechanical Engineering Technology (MET). Will also consider a degree in a relevant technical field or equivalent experience within a semiconductor environment.
• ✓Understanding of and ability to handle structured problem solving 5Y and 8Ds
• ✓MS Word, MS Excel, and MS Access experience.
• ✓Strong written and oral communication skills.
• ✓Strong mechanical and electrical aptitude.

Physical

• ✓Ability to stand, walk, sit, or move around assigned work location without limitation for extended periods of time (i.e. up to 11 hours at a time).
• ✓Experience using hands to operate machinery and/or assemble product.
• ✓Ability to lift up to 50 lbs. to chest height.
• ✓Must be comfortable wearing personal protective equipment or PPE (i.e. lightweight cleanroom suit, eye protection, gloves, etc.).
• ✓Ability to work in repetitive motions and pressure involving fingers, hands, and wrists, includes standing or walking over hard concrete surface, and climbing ladders.