Career Accelerator Program - Packaging Engineer
Texas Instruments · Dallas, TX
- Level
- Engineer
- Team
- Manufacturing
- Degree
- Required
- Industry
- Industrial
- Posted
- 30+ days ago
The role in 30 seconds
An engineer-level manufacturing role at Texas Instruments (industrial) in Dallas, TX. As a Packaging engineer you will enjoy an environment of smart collaboration with a global team of the industry's top engineering minds at your disposal.
- They ask for
- degree required
- Tools it names
- SPC
Read from the posting. The full description is below.
From the plant jobs report · week of November 2, 2026
Manufacturing Engineer roles in Texas: typical posted base $85k–$132k.
Median of the low and high ends of 44 live postings that list pay, out of 237 manufacturing engineer openings in Texas, read from manufacturers' own careers sites.
Texas plant jobs report →Pay by team and state →What moves pay →
How this role compares
Against 236 other live manufacturing postings in Texas.
- Base pay
- Not listed in this posting
- Experience asked
- Not stated
Typical $85k–$132k, from 44 postings that list pay.
Similar roles usually ask 5+ years.
Skills these teams ask for most
- Tooling 45%
- Root cause 43%
- Automation 35%
- Lean 35%
- New product launch 33%
- ✓ SPC 27%
✓ = this posting asks for it too. % = share of similar postings that mention it.
At a glance
Pulled from the posting text. If it's not listed here, the posting didn't say.
How to get in at this plant
Five moves over a week or two. The first one takes ten minutes.
- 1
Pick 2–3 people on the Manufacturing team at Texas Instruments
We found 4 people at this company and state: 4 in this kind of role. Engineers who joined in the last year or two reply the most. See them ↓
- 2
Send a short, curious note
One real question about their work. No favors yet. Each person gets a different note, written for this role.
Write to Andrew → (free) - 3
Turn a reply into a short call
Questions worth asking about this team:
- What does a normal week look like on your team?
- Is the work mostly new product launches or sustaining existing lines?
- How much time do you spend on the floor versus at a desk?
- How did you land the job? What stood out in your interviews?
- 4
Apply with someone vouching for you
If the call went well, ask whether they’d pass your résumé to the hiring manager. Send your résumé link, apply that day, and let them know.
- 5
Bring proof to the interview
One page of before-and-after numbers from projects you led: scrap, OEE, cycle time, cost. Plant managers hire on results.
This plant: Texas Instruments in Dallas
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- DMOS6 Manufacturing Supervisor · Manufacturing · Supervisor
Full description from Texas InstrumentsAs posted on their careers site.ShowHide
responsibilities
- ◆Partner with the businesses to design and develop internal and external solutions for semiconductor packaging technologies, including Wirebond, Flip Chip, Modules, SIPs and other advanced packages at different stages of readiness
- ◆Participate in cross-functional teams, supporting product qualification and production, helping to meet reliability and yield requirements, design testability, and test coverage
- ◆Direct design-of-experiments and work with material suppliers to downselect innovative packaging materials to enhance the reliability and performance of advanced packages.
- ◆Conduct electrical, mechanical, thermal models to comprehend silicon-to-package interaction, establish design rules, and to predict and prevent the use of high risk designs.
As a Packaging engineer you will enjoy an environment of smart collaboration with a global team of the industry's top engineering minds at your disposal. TI's corporate culture is one of competitive spirit which fuels continued business growth and constant career opportunities. While ethical business practice is a central aspect of the work place-you will be treated with respect, dignity, kindness and courtesy.
Put your talent to work with us as a Packaging engineer !
Requirements
- ✓Bachelors degree in Material Science, Mechanical Engineering, Chemical Engineering, Physics, Electrical Engineering or related
- ✓Cumulative 3.0/4.0 GPA or higher
Preferred Qualifications
- ✓Basic understanding of statistical process control (SPC)
- ✓Semiconductor packaging knowledge is preferred (manufacturing processes, assembly, reliability, materials, characterization, FA)
- ✓Demonstrated analytical and problem solving skills
- ✓Strong written and verbal communication skills
- ✓Ability to work in teams and collaborate effectively with people in different functions
- ✓Strong time management skills that enable on-time project delivery
- ✓Ability to build strong, influential relationships
- ✓Ability to work effectively in a fast-paced and rapidly changing environment
- ✓Ability to take the initiative and drive for results
Texas Instruments will not sponsor job applicants for visas or work authorization for this position.
Why TI?
- ✓The future starts here. As a TIer, you'll play a critical role in defining the next era of semiconductor technology and help create the innovations that shape the world around us.
- ✓Surround yourself with a team of innovators who value your unique perspective and will challenge you to bring your best self to work every day. We believe that fostering a culture of collaboration fuels both personal growth and technological breakthroughs. Explore our company culture .
- ✓At TI, your success goes beyond your work. Take advantage of comprehensive benefits designed to support your total well-being at work and in life, from competitive compensation to extensive health coverage and wellness programs. Learn more about our benefits offerings .
About Texas Instruments
Texas Instruments Incorporated (Nasdaq: TXN) is a global semiconductor company that designs, manufactures and sells analog and embedded processing chips for markets such as industrial, automotive, data center, personal electronics and communications equipment. At our core, we have a passion to create a better world by making electronics more affordable through semiconductors. This passion is alive today as each generation of innovation builds upon the last to make our technology more reliable, more affordable and lower power, making it possible for semiconductors to go into electronics everywhere. Learn more at TI.com .
If you are interested in this position, please apply to this requisition.
Show full description ↓Show less ↑
Change the world. Love your job.
In your first year with TI, you will participate in the Career Accelerator Program (CAP), which provides professional and technical training and resources to accelerate your ramp into TI, and set you up for long-term career success. Within this program, we also offer function-specific technical training and on-the-job learning opportunities that will encourage you to solve problems through a variety of hands-on, meaningful experiences from your very first day on the job. The TMG Development program is a 12-month program for new college graduates in the TMG organization.
Interface across various work areas and organizations to help with the design, development and analysis of different semiconductor packaging technologies to enable differentiation for TI's analog and embedded processing products. TI's innovative packaging technologies are designed to solve customers' problems by delivering advances in miniaturization, integration, high reliability, high performance, and low power. In this role you'll get the opportunity to thrive in a fast paced, dynamic environment where high-energy, prioritization skills and adaptability are a must!
Packaging engineers play an important role at TI which encompasses the following
