
Senior Optomechanical Packaging Engineer
MKS Instruments · Milpitas, CA
- Level
- Senior
- Team
- Manufacturing
- Base pay
- $102k–$169k
- Travel
- 10%
- Experience asked
- 8+ years
- Industry
- Industrial
- Posted
- 19 days ago
The role in 30 seconds
A senior manufacturing role at MKS Instruments (industrial) in Milpitas, CA. You will lead the development of advanced optical and optoelectronic packaging solutions for next-generation photonics and optical communication test systems.
- They ask for
- 8+ years
- Tools it names
- Root cause, SPC, Robotics, Automation, Welding
- Base pay
- $102k–$169k
- Day to day
- some off-shift / weekend coverage · about 10% travel
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- 1
Pick 2–3 people on the Manufacturing team at MKS Instruments
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- 2
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- 3
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- What does a normal week look like on your team?
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- 4
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About the role
Requirements
Up to 10% of Travel is required.
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A Day in Your Life at MKS
As an Optomechanical Packaging Engineer at MKS, you will lead the development of advanced optical and optoelectronic packaging solutions for next-generation photonics and optical communication test systems. The successful candidate will be responsible for the design, integration, automation, and qualification of precision optical assemblies, including photodiodes, fiber-coupled devices, optical receivers, laser sources, and photonic integrated circuits (PICs). Emphasis will be placed on active alignment processes, automated assembly equipment, motion control systems, optical packaging architectures, and long-term product reliability. This role requires a hands-on engineer capable of working across optics, mechanics, electronics, manufacturing, automation, and reliability disciplines to transform laboratory prototypes into scalable production products.
You Will Make an Impact By
- •Design precision optomechanical assemblies for fiber optics, photodiodes, laser sources, and photonic integrated circuits.
- •Develop packaging architectures and optics that optimize optical performance, mechanical stability, thermal performance, manufacturability, reliability, and cost.
- •Define optical and mechanical tolerances and alignment budgets.
- •Develop packaging solutions for fiber-to-chip coupling, fiber-to-photodiode coupling, free-space optical systems, laser and detector integration, and multi-channel optical assemblies.
- •Work closely with optical, electrical, and manufacturing engineers throughout the product lifecycle.
- •Lead development of active alignment processes for optical and optoelectronic assemblies. Select and integrate piezo stages, nanopositioners, linear motors, servo systems, and precision encoders.
- •Optimize system accuracy, repeatability, throughput, and robustness.
- •Support integration of optical metrology and machine vision feedback systems.
- •Perform failure mode and root-cause analysis.
- •Define qualification plans including thermal cycling, temperature and humidity testing, mechanical shock and vibration, life testing, and accelerated aging.
- •Support regulatory and customer qualification activities.
- •Generate work instructions, assembly procedures, and production documentation.
- •Support finite element and multi-physics simulations as required.
- •Model packaging-induced optical performance impacts.
- •Correlate simulation results with experimental measurements.
- •Travel
Skills You Bring
- •BS, MS, or PhD in Mechanical Engineering, Optical Engineering, Physics, Mechatronics, or a related field.
- •8+ years of experience developing optomechanical or photonic products.
- •Strong experience in precision optomechanical design.
- •Hands-on experience with active optical alignment processes.
- •Experience developing automated manufacturing or assembly systems.
- •Knowledge of motion control systems and precision positioning technologies.
- •Experience with tolerance analysis and mechanical design.
- •Strong understanding of optical packaging challenges and solutions.
- •Experience supporting products from concept through production release.
- •Strong laboratory troubleshooting and debugging skills.
Preferred Skills
- +Experience packaging photodiodes, lasers, optical receivers, optical transceivers, or photonic integrated circuits (PICs).
- +Experience with optical communication products.
- +Experience developing automated active alignment stations.
- +Experience with machine vision systems and robotic assembly equipment.
- +Familiarity with fiber-attach and photonic packaging processes.
- +Experience with epoxy, solder, eutectic, or laser-welding attachment methods.
- +Experience with reliability qualification standards such as Telcordia, MIL, or IEC.
- +Familiarity with statistical process control and yield analysis.
- +Experience working with external packaging houses and manufacturing partners.
Physical Demands and Working Conditions
- •Physical Demands and Working Conditions: Work in an office and laboratory environment. Lift laboratory equipment up to 20 lbs.
We are interested in a qualified candidate who is eligible to work in the United States. However, we will not be sponsoring work visas for this position, at this time.
