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Senior Optomechanical Packaging Engineer

MKS Instruments · Milpitas, CA

Level
Senior
Team
Manufacturing
Base pay
$102k–$169k
Travel
10%
Experience asked
8+ years
Industry
Industrial
Posted
19 days ago

The role in 30 seconds

A senior manufacturing role at MKS Instruments (industrial) in Milpitas, CA. You will lead the development of advanced optical and optoelectronic packaging solutions for next-generation photonics and optical communication test systems.

They ask for
8+ years
Tools it names
Root cause, SPC, Robotics, Automation, Welding
Base pay
$102k–$169k
Day to day
some off-shift / weekend coverage · about 10% travel

Read from the posting. The full description is below.

It asks for 8+ years. If you're close, apply anyway: requirements are a wish list. Talk to someone on the team first.

At a glance

Off-shift / weekend coverageLifts up to 20 lbs

Pulled from the posting text. If it's not listed here, the posting didn't say.

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    • Is the work mostly new product launches or sustaining existing lines?
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About the role

Requirements

Up to 10% of Travel is required.

Show full description ↓

A Day in Your Life at MKS

As an Optomechanical Packaging Engineer at MKS, you will lead the development of advanced optical and optoelectronic packaging solutions for next-generation photonics and optical communication test systems. The successful candidate will be responsible for the design, integration, automation, and qualification of precision optical assemblies, including photodiodes, fiber-coupled devices, optical receivers, laser sources, and photonic integrated circuits (PICs). Emphasis will be placed on active alignment processes, automated assembly equipment, motion control systems, optical packaging architectures, and long-term product reliability. This role requires a hands-on engineer capable of working across optics, mechanics, electronics, manufacturing, automation, and reliability disciplines to transform laboratory prototypes into scalable production products.

You Will Make an Impact By

  • •Design precision optomechanical assemblies for fiber optics, photodiodes, laser sources, and photonic integrated circuits.
  • •Develop packaging architectures and optics that optimize optical performance, mechanical stability, thermal performance, manufacturability, reliability, and cost.
  • •Define optical and mechanical tolerances and alignment budgets.
  • •Develop packaging solutions for fiber-to-chip coupling, fiber-to-photodiode coupling, free-space optical systems, laser and detector integration, and multi-channel optical assemblies.
  • •Work closely with optical, electrical, and manufacturing engineers throughout the product lifecycle.
  • •Lead development of active alignment processes for optical and optoelectronic assemblies. Select and integrate piezo stages, nanopositioners, linear motors, servo systems, and precision encoders.
  • •Optimize system accuracy, repeatability, throughput, and robustness.
  • •Support integration of optical metrology and machine vision feedback systems.
  • •Perform failure mode and root-cause analysis.
  • •Define qualification plans including thermal cycling, temperature and humidity testing, mechanical shock and vibration, life testing, and accelerated aging.
  • •Support regulatory and customer qualification activities.
  • •Generate work instructions, assembly procedures, and production documentation.
  • •Support finite element and multi-physics simulations as required.
  • •Model packaging-induced optical performance impacts.
  • •Correlate simulation results with experimental measurements.
  • •Travel

Skills You Bring

  • •BS, MS, or PhD in Mechanical Engineering, Optical Engineering, Physics, Mechatronics, or a related field.
  • •8+ years of experience developing optomechanical or photonic products.
  • •Strong experience in precision optomechanical design.
  • •Hands-on experience with active optical alignment processes.
  • •Experience developing automated manufacturing or assembly systems.
  • •Knowledge of motion control systems and precision positioning technologies.
  • •Experience with tolerance analysis and mechanical design.
  • •Strong understanding of optical packaging challenges and solutions.
  • •Experience supporting products from concept through production release.
  • •Strong laboratory troubleshooting and debugging skills.

Preferred Skills

  • +Experience packaging photodiodes, lasers, optical receivers, optical transceivers, or photonic integrated circuits (PICs).
  • +Experience with optical communication products.
  • +Experience developing automated active alignment stations.
  • +Experience with machine vision systems and robotic assembly equipment.
  • +Familiarity with fiber-attach and photonic packaging processes.
  • +Experience with epoxy, solder, eutectic, or laser-welding attachment methods.
  • +Experience with reliability qualification standards such as Telcordia, MIL, or IEC.
  • +Familiarity with statistical process control and yield analysis.
  • +Experience working with external packaging houses and manufacturing partners.

Physical Demands and Working Conditions

  • •Physical Demands and Working Conditions: Work in an office and laboratory environment. Lift laboratory equipment up to 20 lbs.

We are interested in a qualified candidate who is eligible to work in the United States. However, we will not be sponsoring work visas for this position, at this time.

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