Advanced Packaging Process Engineer
Intel · Arizona
- Level
- Engineer
- Team
- Process
- Base pay
- $115k–$220k
- Experience asked
- 3+ years
- Industry
- Industrial
- Posted
- 20 days ago
The role in 30 seconds
An engineer-level process role at Intel (industrial) in Arizona. You Will Bring.
- They ask for
- 3+ years
- Tools it names
- SPC, DOE
- Base pay
- $115k–$220k
Read from the posting. The full description is below.
At a glance
Pulled from the posting text. If it's not listed here, the posting didn't say.
How to get in at this plant
Five moves over a week or two. The first one takes ten minutes.
- 1
Pick 2–3 people on the Process team at Intel
We found 14 people at this company and state: 13 on the team, 1 leaders, plus 3 likely hiring managers. Engineers who joined in the last year or two reply the most. See them ↓
- 2
Send a short, curious note
One real question about their work. No favors yet. Each person gets a different note, written for this role.
Write to Yunus → (free) - 3
Turn a reply into a short call
Questions worth asking about this team:
- What does a normal week look like on your team?
- Is the work mostly new product launches or sustaining existing lines?
- How much time do you spend on the floor versus at a desk?
- How did you land the job? What stood out in your interviews?
- 4
Apply with someone vouching for you
If the call went well, ask whether they’d pass your résumé to the hiring manager. Send your résumé link, apply that day, and let them know.
- 5
Bring proof to the interview
One page of before-and-after numbers from projects you led: scrap, OEE, cycle time, cost. Plant managers hire on results.
About the role
Key Responsibilities
- ◆Develop and optimize packaging assembly processes and equipment to meet stringent quality, reliability, yield, and cost targets in high-volume manufacturing environments.
- ◆Design and execute experiments using Statistical Process Control (SPC) and Design of Experiments (DOE) to characterize processes and drive continuous improvement.
- ◆Innovate new techniques, materials, and tools to address emerging challenges in semiconductor packaging performance and reliability.
- ◆Collaborate with cross-functional teams across engineering, manufacturing, and product development to identify technical risks and ensure successful product launches.
- ◆Establish specifications for materials and equipment, ensuring adherence to Intel's quality and operational standards.
- ◆Document and communicate technical findings, process improvements, and experimental results through reports, white papers, and qualification documents.
- ◆Lead standardization efforts for manufacturing systems, equipment setups, and process flows across Intel's global sites.
qualifications
to be initially considered for this position.
requirements
and are considered a plus factor in identifying top candidates. Experience would be obtained through a combination of prior education level classes, and current level school classes, projects, research and relevant previous job and/or internship experience. This Position is not eligible for Intel immigration sponsorship.
Qualifications
- ✓Master's and 3+ years in relevant experience, or PhD in Mechanical Engineering, Physics, Chemistry, or a related STEM field with 1+ years of experience.
- ✓Relevant experience will be the following:
- ✓Process development and equipment qualification in a manufacturing setting.
Preferred Qualifications
- ✓3+ years of experience in:
- ✓Data analysis and risk assessment methodologies.
- ✓Statistical Process Control (SPC), Design of Experiments (DOE), and process characterization techniques. Semiconductor fabrication processes, assembly methodologies, and packaging flows (e.g., flip chip, fan-out, 2.5D/3D integration). Programming languages such as Python, MATLAB, or SQL for complex data analysis. Quality systems, documentation standards, and packaging reliability evaluation tools.
Show full description ↓Show less ↑
Job Description
Intel is one of the world's most iconic technology companies, driving innovation in semiconductors for over five decades. From the chips that power your laptop to the processors enabling artificial intelligence and autonomous vehicles, Intel's technology is woven into the fabric of modern life. Our Advanced Packaging Technology Manufacturing (APTM) organization is at the heart of Intel's next chapter — developing and commercializing the packaging technologies that will define the future of computing. We are committed to building a diverse, inclusive, and innovative workplace where every employee can do their best work and make a real difference.
We are looking for a talented and driven Packaging Module Development Engineer to join our APTM team at Intel's world-class manufacturing campus in Chandler, Arizona. In this role, you will be a key contributor to the development, optimization, and qualification of advanced semiconductor packaging processes — work that directly enables Intel's products to reach billions of people around the world.
Whether you're a recent PhD graduate eager to apply your research expertise or an experienced engineer ready to take on new challenges, this is an opportunity to do meaningful, high-impact work alongside some of the best engineers in the semiconductor industry.
As a Successful Candidate, You Will Bring
- •Intellectual curiosity — a genuine passion for understanding how things work and a drive to continuously learn and improve.
- •Collaborative spirit — the willingness to work effectively with diverse, cross-functional teams and build strong working relationships.
- •Resilience and adaptability — comfort navigating ambiguity and the skills to pivot quickly when challenges arise.
- •Clear communication — the skills to translate complex technical findings into clear, actionable insights for a variety of audiences.
- •Ownership mindset — a proactive approach to taking responsibility for outcomes and driving projects to completion.
- •Creative problem-solving — the skills to think outside the box and develop innovative solutions to complex engineering challenges.
Are you ready to take the next step in your career and be part of a team that is shaping the future of technology? Apply today and join Intel's Oregon team, where your expertise and passion will directly influence the world's most advanced semiconductor manufacturing processes.
Job Type
College Grad
Shift
Shift 1 (United States of America)
Primary Location
US, Arizona, Phoenix
Posting Statement
Position of Trust
N/A
Benefits
The range displayed on this job posting reflects the minimum and maximum target compensation for the position across all US locations. Within the rang